doc. no : qw0905- rev. : date : 12 - jul - 2005 la118b/ 260-i d data sheet ligitek electronics co.,ltd. property of ligitek only led array la118b/260-i
note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. lg2640/s63 1/5 la118b/260-i page part no. package dimensions ligitek electronics co.,ltd. property of ligitek only lg2640-1 2.9 3.1 ?? 0.5 typ 25.0min 2.54typ 1.0min 3.3 4.3 1 2 y g 1 2 320.5 0.5 typ - + 2.54typ 4.3 3.3 1.5max 3.1 2.9 4fd 21.2 0.5typ 3.30.3 - + 12 - + 12 14.020.5 11.480.5 8.940.5 6.40.5 3rd 2nd 1st 5.08 8.81 4.5 17.1 +0.15 -0.3 1st are lg2640/s63 2nd and 4fd are lyg2662 3rd are lg2640-1 0.8 lyg2662 25.0min 3.1 2.9 0.5 typ 2.54typ 1.0min 1.5max 4.3 3.3 +-
part no. absolute maximum ratings at ta=25 j la118b/260-i part no note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. typical electrical & optical characteristics (ta=25 j ) forward current peak forward current duty 1/10@10khz operating temperature soldering temperature storage temperature reverse current @5v power dissipation peak wave length f pnm material green emitted gap 565 lens green diffused color viewing angle 2 c 1/2 (deg) spectral halfwidth ??f nm 20 luminous intensity @10ma(mcd) forward voltage @ ma(v) 12 min. 2.6 max. 30 1.7 min. typ. 20 50 tstg tsol ir t opr -40 ~ +100 max 260 j for 5 sec max (2mm from body) j 10 -40 ~ +85 g a j i f pd i fp parameter symbol ma 30 120 100 ma mw g ratings unit ligitek electronics co.,ltd. property of ligitek only 2/5 page 20 60 80 y gaasp/gap yellow 50 35 585 2.6 1.7 12 4.5 white diffused gap green 50 565 30 1.7 2.6 15 8.0 la118b/260-i
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) page forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip part no. 3/5 la118b/260-i
3.0 2.5 1.5 1.0 0.5 0.0 2.0 fig.4 relative intensity vs. temperature 1.0 relative intensity@20ma 550 wavelength (nm) 500 0.0 0.5 600 650 700 ambient temperature( j ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature forward voltage@20ma normalize @25 j -40 0.8 -20 1.0 0.9 1.1 1.2 relative intensity@20ma normalize @25 j 40 20 060100 80 ambient temperature( j ) -40 -20 020 60 40 100 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current typical electro-optical characteristics curve part no. 2.0 fig.1 forward current vs. forward voltage forward voltage(v) 100 forward current(ma) 1.0 0.1 10 1.0 y chip 1000 relative intensity normalize @20ma 3.0 4.0 5.0 4/5 page forward current(ma) 1.0 10 100 1000 la118b/260-i
mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec solderability test this test intended to see soldering well performed or not. 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles solder resistance test thermal shock test high temperature high humidity test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hous. part no. page 5/5 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) low temperature storage test high temperature storage test the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. test condition test item reliability test: description reference standard ligitek electronics co.,ltd. property of ligitek only la118b/260-i
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